Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-09-15
1996-02-13
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 524, 257686, 257700, 437207, 437209, H05K 336
Patent
active
054903246
ABSTRACT:
An integrated circuit package, as well as a method for fabricating the same, is herein disclosed. The integrated circuit package of the present invention includes a cavity located within an assembly of laminated printed wiring boards. Such cavity provides two or more bonding tiers for connection with a semiconductor die. The contact pads are further connected, through conductive vias, to external connection means such as solder balls or pins. The semiconductor die is encapsulated with a molding compound through a transfer molding process. The present invention is especially advantageous in manufacturing pin grid array ("PGA") and ball grid array ("BGA")integrated circuit packages.
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Arbes Carl J.
LSI Logic Corporation
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