Method of taking out lead of semiconductor tip part

Details Method of taking out lead of semiconductor tip part Method of taking out lead of semiconductor tip part

1988-05-19

1989-07-25

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 357 72, 357 80, H05K 330

Patent

active

048501050

ABSTRACT:
A method of removing a lead from a semiconductor tip part is provided by inserting the tip part in a through hole of a substrate. The tip part is equalized in height with substrate by adhering an adhesive tape across the through hole. A gap is left between the tip part and through hole which is filled with an insulative resin. If the substrate already has electrically conductive portions on it, a conductive paste is printed on the substrate between conductive portions and the tip part. If the substrate does not already have them, the conductive portions are formed by the addition of conductive paste on the substrate and which extends to the tip part.

REFERENCES:
patent: 3480836 (1969-11-01), Aronstein
patent: 3570115 (1971-03-01), Barnes
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4466181 (1984-08-01), Takishima
patent: 4635356 (1987-01-01), Ohuchi et al.

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