Moulded printed circuit board

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428280, 428284, 428285, 428286, 428287, 428457, 428458, 4284744, 428901, 174 35MS, B32B 900

Patent

active

049237357

ABSTRACT:
The invention relates to a thermoplastic moulded printed circuit board consisting substantially of polyamide 4.6. Preferably use is made of a multilayer structure, of which at least one layer contains reinforcing filler material.

REFERENCES:
patent: 2606162 (1952-08-01), Coffey et al.
patent: 2892747 (1959-06-01), Dye
patent: 4165303 (1979-08-01), Schlossmen et al.
patent: 4719284 (1988-01-01), Nielinger et al.
patent: 4722997 (1988-02-01), Roerdink et al.
patent: 4760109 (1988-07-01), Chiba
patent: 4761445 (1988-08-01), Chiba
Modern Plastics Encyclopedia, 1989, pp. 30-31; 1980-1981, p. 40; and 1977-1978, pp. 41-42.

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