Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1988-12-23
1990-05-08
Ryan, Patrick
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428220, 428224, 428260, 428289, 428290, 4284111, 428457, 428458, 428480, 4285395, 428332, 428577, 428615, 428901, 427 96, 156 60, 156228, 430311, 430313, 430315, 430319, B32B 900
Patent
active
049237349
ABSTRACT:
Printed wiring boards useful for high frequency applications are obtained by laminating a conductive foil pretreated with a silane to a polynorbornene prepreg wherein a sheet of polyolefin film derived from C.sub.2 -C.sub.4 monomers is laminated between the prepreg and the foil to the surfaces of each member. The prepreg is made by impregnating a fiberglass cloth with a ring-opening polymerized polymer. The conductive foil is pretreated with a silane which is capable of improving the bond strength between the conductive foil and a norbornene copolymer.
REFERENCES:
patent: 3318758 (1967-05-01), Tell
patent: 3508983 (1970-04-01), Origer et al.
patent: 3558423 (1971-01-01), Rossetti, Jr.
patent: 4136247 (1979-01-01), Tenney et al.
patent: 4178424 (1979-12-01), Tenney et al.
patent: 4241132 (1980-12-01), Pratt et al.
patent: 4292106 (1981-09-01), Herschdorfer et al.
patent: 4315970 (1982-02-01), McGee
patent: 4329270 (1982-05-01), Meyer, Jr. et al.
patent: 4366280 (1982-12-01), Yukawa
patent: 4372800 (1983-02-01), Oizumi et al.
patent: 4444951 (1984-04-01), Mendelson
patent: 4451317 (1984-05-01), Oizumi et al.
patent: 4571279 (1986-02-01), Oizumi et al.
patent: 4639285 (1987-01-01), Suzuki et al.
patent: 4831094 (1989-05-01), Stein et al.
Chemical Abstract No. 98: 162024m, "Metal Covered Laminates".
Chemical Abstract No. 98: 162025n, "Metal Covered Laminates".
Chemical Abstract No. 98: 162026p, "Metal Covered Laminates".
Chemical Abstract No. 72: 124634r, "Hybrid Polyimide/Epoxy Glass Multilayer Fabrication".
Chemical Abstract No. 105: 135048d, "Multi-Layer Circuit Boards".
Chemical Abstract No. 107: 97841p, "Polycyclic Olefin Laminated Boards".
Chemical Abstract No. 107: 8574p, "Epoxy Prepregs for Printed-Wiring Boards".
Chemical Abstract No. 107: 8575q, "Epoxy Prepregs for Printed-Wiring Boards".
WPI No. 83-00996K/01, "Metal Glass Laminated Plate Manufacture Using Adhesive Comprising Silyl-Modified Organic Polymer".
WPI No. 83-759725/37, "Bonding Copper Foil to Backing Material Using Silane Compound as Adhesion Promoter; PCB Print Circuit Board".
WPI No. 74-34559V/19, "Metallised Plastic Substrate, e.g., Electronic Circuit-By Laminating Pretreated Metal Sheet with Plastic Substrate, Removing Metal Layer, and Metallising Exposed Surface".
WPI No. 85-162927/27, "Copper Coated Laminated Plate Production for PCB, Using Unsaturated Resin, e.g., Polyester or Vinyl Ester to Impregnate Base Material".
"Today's Substrates", Murray, Circuits Manufacturing, Nov. 1987, p. 25.
"G-10FR Epoxy/Glass Fabric General Purpose Laminate", Norplex, Product Bulletin.
"Adhesion in Mineral-Organic Composites", D. M. Brewis, D. Briggs, John Wiley & Sons, Industrial Adhesion Problems, Chapter 6.
The Kirk-Othmer Encyclopedia of Chemical Technology, John Wiley & Sons, 1982, vol. 20.
"Some Approaches to Low Dielectric Constant Matrix Resins for Printed Circuit Boards", Butler et al., 15th National SAMPE Technical Conference, 1983.
Ryan Patrick
The B. F. Goodrich Company
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