Tray for integrated circuit

Details Tray for integrated circuit Tray for integrated circuit

1989-10-02

1992-04-14

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

252506, 252508, 252518, 252521, 252509, 523457, 523459, 523468, H01B 106

Patent

active

051045818

ABSTRACT:
A tray for an integrated circuit comprising a thermosetting resin compound comprising 20 to 180 parts by weight of a filler with a water absorption of 0.45% or less and 15 to 45 parts by weight of electroconductive carbon black added to 100 parts by weight of a thermosetting resin with a water adsorption of 0.45% or less, desirably with 5 to 15 parts by weight of an acrylonitrile-butadiene type rubber, said tray having a surface resistance of 10.sup.2 to 10.sup.6 .OMEGA., a water absorption of 0.45% or less than a glass transition temperature of 150.degree. C. or higher.

REFERENCES:
patent: 4715989 (1987-12-01), Sullivan et al.
patent: 4783279 (1988-11-01), Petermann et al.
patent: 4835240 (1989-05-01), Togashi et al.
patent: 4876033 (1989-10-01), Jurgen et al.

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