Method of making porous inorganic particle filled polyimide foam

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156245, 1563315, 1563318, 264 53, 264 71, 264129, 428290, 4283144, 4283179, 4283191, 521 54, 521 91, 521122, 521123, 521184, 521185, 521189, 523218, 523219, B32B 518, B32B 3114

Patent

active

049235389

ABSTRACT:
A method of making thermal insulating products comprising porous, lightweight, high temperature resistant inorganic particles in a polyimide foam matrix and the product thereof. A polyimide precursor powdered is mixed with about equal weight of flake-like porous inorganic particles to substantially uniformly coat the particles with powder. The mixture is placed in a mold and compressed slightly. The assembly is heated to the foaming temperature of the polyimide precursor for a period suitable to produce uniform foaming. Then the temperature is raised to the curing and crosslinking temperature of the precursor for a time period sufficient to produce complete cure. A high temperature and flame resistant, light weight, highly insulating product results. If desired, protective sheets of material may be bonded to selected product surfaces during or after the molding operation.

REFERENCES:
patent: 4518717 (1985-05-01), Long et al.
patent: 4520071 (1985-05-01), Noda et al.
patent: 4814356 (1989-03-01), Bongers et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making porous inorganic particle filled polyimide foam does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making porous inorganic particle filled polyimide foam, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making porous inorganic particle filled polyimide foam will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2347114

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.