Method for producing hybrid integrated circuit

Details Method for producing hybrid integrated circuit Method for producing hybrid integrated circuit

1984-11-08

1987-01-13

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 29590, 29840, 156241, 156326, C08L 2326

Patent

active

046353461

ABSTRACT:
A method for producing a hybrid integrated circuit includes steps of: applying an adhesive to an electronic part mounting conductor on an insulating substrate; adhering an electronic part to the applied adhesive and hardening the adhesive to temporarily fix the electronic part; fixing the temporarily fixed electronic part on the conductor with solder; and dissolving the hardened adhesive in a solvent and removing it. Upon being hardened, the adhesive can withstand the heat of molten solder and can be dissolved in a solvent and removed therewith.

REFERENCES:
patent: 3644252 (1972-02-01), Shenfeld et al.
patent: 3955997 (1976-05-01), Sagane et al.
patent: 4157319 (1979-06-01), Feeney et al.
patent: 4215025 (1980-07-01), Packer et al.
patent: 4251597 (1981-02-01), Emmons et al.
patent: 4329779 (1982-05-01), England
patent: 4444858 (1984-04-01), Nishibu et al.

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