Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1994-08-15
1998-01-06
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257717, 257719, 257706, 257722, 361676, 361697, 361831, H01L 2110, H01L 2334, H02B 100, H02B 101
Patent
active
057058504
ABSTRACT:
The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
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Ashiwake Noriyuki
Daikoku Takahiro
Hatada Toshio
Iino Toshiki
Kasai Kenichi
Clark Jhihan B.
Hitachi , Ltd.
Saadat Mahshid D.
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