Polyimide film having improved adhesive properties

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428330, 428458, 4284735, 428901, 427 40, B32B 516, B32B 1508, B32B 2706

Patent

active

047554240

ABSTRACT:
A polyimide film produced by forming a film from a raw material incorporated with a finely divided inorganic powder that forms minute projections on the film surface and subsequently subjecting the film to corona discharge treatment. According to this invention, it is possible to obtain a heat-resistant polyimide film having improved adhesive properties and uniform bond strength. The film does not cause blocking when wound into a roll.

REFERENCES:
patent: 4601916 (1986-07-01), Arachingi
patent: 4612235 (1986-09-01), Ushimaru et al.

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