Method to ensure the cooling of electronic components fixed on a

Details Method to ensure the cooling of electronic components fixed on a Method to ensure the cooling of electronic components fixed on a

1986-06-04

1988-07-05

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 174 685, B32B 300, H05K 100

Patent

active

047554177

ABSTRACT:
The method ensures the cooling of electronic components fixed on a multilayer, with at least a metal layer interposed between insulating layers, through successive steps for the obtaining of seats or cavities or through-holes with metallized surface, the seats or cavities having the bottom formed by said metal layer and the through-holes being formed in the vicinity of the same seats; the cooling of the component is achieved by heat conduction along said metal layer, or by dissipator means located outside the multilayer and in thermal conductivity connection with said metal layer.

REFERENCES:
patent: 4432037 (1984-02-01), Brabetz

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