Processes for the deposition or removal of metals

Details Processes for the deposition or removal of metals Processes for the deposition or removal of metals

1987-03-03

1988-07-05

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 431, 204 461, 204 47, 204 475, 204 48, 204 49, 204 51, 204 521, 204 53, 204 541, 204 551, 204 561, 204 585, 20412985, 20412995, 427319, 427320, C25D 302, C25F 300, B05D 302

Patent

active

047552654

ABSTRACT:
Methods for depositing metals on or removing metals from substrates are provided which involve the use of electrolytic cells comprising an anode and cathode, sulfuric acid, and a chalcogen-containing compound soluble in said bath and having the empirical formula ##STR1## wherein X is a chalcogen, each of R.sub.1 and R.sub.2 is selected from hydrogen, NR.sub.3 R.sub.4 and NR.sub.5, at least one of R.sub.1 and R.sub.2 is other than hydrogen, each of R.sub.3 and R.sub.4 is hydrogen or a monovalent organic radical, and R.sub.5 is a divalent organic radical, in which the molar ratio of the chalcogen compound to sulfuric acid is about 1 or more, and the molar ratio of water to the combination of acid and chalcogen compound is about 20 or less. These methods enable the use of higher concentrations of strong acids than would otherwise be possible, minimize hydrogen and/or oxygen evolution at the electrodes with attendant advantages, and are useful for electroplating (including immersion plating), electroforming, electrolytic machining, electropolishing, electrolytic roughening, anodizing and electrowinning among others.

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