Solder paste for chip components

Details Solder paste for chip components Solder paste for chip components

1997-11-14

2000-04-18

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

22818022, B23K 3100, B23K 3102

Patent

active

060504803

ABSTRACT:
A solder paste suitable for use in reflow soldering of chip components having good soldering properties without causing tombstoning comprises a solder powder admixed with a viscous flux. The solder powder is comprised of a twin peak solder alloy consisting essentially, on a weight basis, of: 60-65% Sn, 0.1-0.6% Ag, 0.1-2% Sb, and a balance of Pb, and having a liquidus temperature below 200.degree. C.

REFERENCES:
patent: 5514912 (1996-05-01), Ogashiwa
patent: 5690890 (1997-11-01), Kawashima et al.

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