Fishing – trapping – and vermin destroying
Patent
1995-06-07
1998-01-06
Trinh, Michael
Fishing, trapping, and vermin destroying
437 41TFI, 437101, 437228PE, H01L 2184
Patent
active
057054118
ABSTRACT:
A thin film semiconductor device includes a gate electrode, a gate insulating electrode, a thin film semiconductor layer, an ohmic layer, source and drain electrodes, and a protective layer. The protective layer contains an impurity for controlling conductivity.
REFERENCES:
patent: 4624737 (1986-11-01), Shimbo
patent: 4790903 (1988-12-01), Sugano et al.
patent: 4843265 (1989-06-01), Jiang
patent: 4874459 (1989-10-01), Coldren et al.
patent: 4882295 (1989-11-01), Gzubatyj et al.
patent: 5054887 (1991-10-01), Kato et al.
patent: 5071779 (1991-12-01), Tanaka et al.
patent: 5114869 (1992-05-01), Tanaka et al.
patent: 5150181 (1992-09-01), Takeda et al.
patent: 5160835 (1992-11-01), Yaggu
patent: 5166816 (1992-11-01), Kaneko et al.
patent: 5202572 (1993-04-01), Kobayashi et al.
patent: 5308996 (1994-05-01), Itabashi et al.
patent: 5338690 (1994-08-01), Fukaya et al.
patent: 5362660 (1994-11-01), Kwasnick et al.
Wolf et al, Silicon Processing for the VLSI Era, vol. 1, 1986, pp. 540-549.
"Effect of .alpha.-SiN.sub.x :H composition on band being near the interface of .alpha.-Si:H/.alpha.-SiN.sub.x :H layered structures," K. Hiranaka et al., Journal of Applied Physics, vol. 60, No. 12, Dec. 15, 1986, pp. 4204-4206.
"Influence of an .alpha.-SiN.sub.x :H gate insulator on an amorphous silicon thin-film transistor," K. Hiranaka et al., Journal of Applied Physics, vol. 62, No. 5, Sep. 1, 1987, pp. 2129-2133.
"Step doping in hydrogenated amorphous silicon thin-film transistors for threshold voltage shifts," T. Matsumoto et al., Journal of Applied Physics, vol. 66, No. 10, Nov. 15, 1989, pp. 5058-5062.
"The Physics of Amorphous-Silicon Thin-Film Transistors," M. J. Powell, IEEE Transactions on Electron Devices, vol. 36, No. 12, Dec. 1989, pp. 2753-2763.
"Characteristics of Hydrogenated Amorphous Silicon Thin Film Transistors Fabricated by D.C. Magnetron Sputtering," A. Kolodziej et al., Thin Solid Films, vol. 175, No. 1, Lausanne, CH, pp. 37-42.
T. Wantanabe et al., "Dielectric breakdown of gate insulator due to reactive ion etching," Solid State Technology, vol. 27, No. 4, Apr. 1984 pp. 263-266.
P. Sudraud et al., "Focused ion beam repair in microelectronics", Microelectronic Engineering, vol. 6, No. 1-4, Dec. 1987, pp. 583-595.
W. Heywang, "Amorphe und polykristalline Halbleiter," Springer, Berlin 1984, pp. 64-67.
Ishii Takayuki
Yamanobe Masato
Canon Kabushiki Kaisha
Trinh Michael
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