Method of manufacturing a ceramic substrate

Details Method of manufacturing a ceramic substrate Method of manufacturing a ceramic substrate

1994-01-31

1996-08-20

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156247, 264 61, 264 63, 29851, 427 58, 427 96, 437183, B32B 3104, B32B 3112, B32B 3124, C04B 4181

Patent

active

055475302

ABSTRACT:
The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.

REFERENCES:
patent: 4461077 (1984-07-01), Hargis
patent: 5085720 (1992-02-01), Mikeska et al.
patent: 5093986 (1992-03-01), Mandai et al.
patent: 5130067 (1992-07-01), Flaitz et al.
patent: 5135595 (1992-08-01), Acocella et al.
Search Report for European Appl. 94101559.6, mailed Nov. 22, 1994.

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