Method and apparatus for conditioning a semiconductor polishing

Details Method and apparatus for conditioning a semiconductor polishing Method and apparatus for conditioning a semiconductor polishing

1994-03-21

1996-08-20

Rachuba, Maurina T.

Abrading

Abrading process

Combined abrading

451443, B24B 5300

Patent

active

055474179

ABSTRACT:
A method of polishing a thin film formed on a semiconductor substrate. In a method of the present invention a polishing pad is rotated. A substrate is pressed against the rotating polishing pad so that the thin film to be polished is placed in direct contact with the polishing pad. During polishing, the polishing pad is continually conditioned by forming a plurality of grooves into the polishing pad. The grooves are formed by a conditioning block having a substantially planar bottom surface with a plurality of groove generating points extending from the substantially planar surface of the conditioning block. The grooves are generated by sweeping and rotating the conditioning block between an outer radius and an inner radius of the polishing pad.

REFERENCES:
patent: 2826009 (1958-03-01), Shurson et al.
patent: 4481738 (1984-11-01), Tabuchi
patent: 4839993 (1989-06-01), Masuko et al.
patent: 4984390 (1991-01-01), Kobayashi
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5384986 (1995-01-01), Hirose et al.

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