Thin layer composite unimorph ferroelectric driver and sensor

Details Thin layer composite unimorph ferroelectric driver and sensor Thin layer composite unimorph ferroelectric driver and sensor

1995-04-04

1997-05-27

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29 2535, 156160, 310311, 264229, H01L 4122

Patent

active

056328419

ABSTRACT:
A method for forming ferroelectric wafers is provided. A prestress layer is placed on the desired mold. A ferroelectric wafer is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinforcing material and the ferroelectric wafer may include electrodes or electrode layers may be placed on either side of the ferroelectric layer. Wafers produced using this method have greatly improved output motion.

REFERENCES:
patent: 3631383 (1971-12-01), Zilinskas
patent: 5042493 (1991-08-01), Saito et al.

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