Molded-in lead frames

Details Molded-in lead frames Molded-in lead frames

1995-05-01

1997-01-21

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257672, 361813, H01L 23495

Patent

active

055962246

ABSTRACT:
The disclosure features lead frames, molded lead frames and adapters and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements. The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.

REFERENCES:
patent: 3588616 (1971-06-01), Palazzini
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4278311 (1981-07-01), Scheingold et al.
patent: 4378139 (1983-03-01), Griffin et al.
patent: 4381131 (1983-04-01), Demnianiuk
patent: 4393581 (1983-07-01), Cherian
patent: 4497012 (1985-01-01), Gottlieb et al.
patent: 4504105 (1985-03-01), Barkus et al.
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4521828 (1985-06-01), Fanning
patent: 4560216 (1985-12-01), Egawa
patent: 4614387 (1986-09-01), Hartl
patent: 4677526 (1987-06-01), Muehling
patent: 4811167 (1989-03-01), Rippey et al.
patent: 5065279 (1991-11-01), Lazenby et al.
patent: 5438481 (1995-08-01), Murphy et al.
Electronics, "How to Make Pin-Grid Arrays at Half The Cost", (Feb. 1987), pp. 36, 40.
Autosplice Advertisement, Electronics Packaging & Protection Sep. 1984.
Werther, "Molded Thermoplastics for Pin-Grid Array Chip Packaging", Photocircuits (May 1986), pp. 267-280.
AMP Advertisement, 196 Position Micro-Pitch Surface Mount Socket, Jan. 1993.
PEM, "Miniature Self-clinching Fasteners", Bulletin FE-981 Aug. 1982.
Advertisement, Advanced Interconnections, "Solder Preform Sockets" Dec. 1988.
Murphy, "Sub-Surface Mount Decoupling Capacitor Sockets with New Molded in Circuit", Advanced Interconnections Corp., pp. 595-597 Oct. 1988.
Schaper et al., "Improved Electrical Performance Required for MOS Packaging", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-6, Sep. 1983, pp. 283-289.
Matsushita Full Line Catalog, "Connectors", 1992, pp. 123, 125-127, 130, 132-133, 138.

Affiliated with

Also associated with

Rating

Molded-in lead frames does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molded-in lead frames, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded-in lead frames will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2326184