Curing apparatus

Heating – Work chamber having heating means – Having means by which work is progressed or moved mechanically

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F27B 900

Patent

active

056326173

ABSTRACT:
A curing apparatus for drying bonding material that is used for bonding, for example, chips to a lead frame for semiconductor devices including a plurality of heating blocks which are spacedly installed in a conveying direction of workpieces and each of the heating blocks is provided with heat-insulating plates on its lower surface, both side surfaces and both end surfaces so as to facilitate temperature control of each of the heating blocks.

REFERENCES:
patent: 3374995 (1968-03-01), Cook
patent: 4310745 (1982-01-01), Bender
patent: 5154604 (1992-10-01), Arai
patent: 5267853 (1993-12-01), Arai

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