Method for formation of conductor using electroless plating

Details Method for formation of conductor using electroless plating Method for formation of conductor using electroless plating

1995-06-27

1997-01-21

Niebling, John

Fishing, trapping, and vermin destroying

437195, 427 98, 427437, H01L 2128

Patent

active

055959431

ABSTRACT:
A method for forming a conductor circuit is provided which comprises depositing and filling a conductor metal in recessions of insulator in the form of grooves or holes using an electroless plating solution, the conductor metal being deposited and filled in the recession to the same level as the surface of the insulator, wherein said electroless plating solution contains an inhibitor which inhibits the cathodic partial reaction which is a metal deposition reaction and the electroless plating is carried out with stirring the plating solution. Since the plating reaction automatically stops when the metal conductor 1 is formed up to the level of the surface of the insulator 2, a conductor circuit in which the surface of the metal conductor 1 and that of the insulator 2 are even and at the same level can be easily obtained. Furthermore, since the conductor circuits differing in thickness can be simultaneously formed on one substrate, the number of lamination in making multilayer circuit can be reduced and a multilayer circuit board of low electric resistance can be obtained.

REFERENCES:
patent: 4695489 (1987-09-01), Zarnoch et al.
patent: 5017516 (1991-05-01), van der Putten
patent: 5198389 (1993-03-01), van der Putten et al.
J. Pukovic, "Feature-Scale Simulation of Resist Patterned Electrodeposition", IBM J. Res. Develop. vol. 37 No. 2, Mar. 1993, pp. 125-141.
J. Jacobs et al, "Oxygen-Diffusion-Size Effect in Electroles Metal Deposition", J. Electrochem. Soc. vol. 135, No. 11, Nov. 1993, pp. 2822-2827.
A. van der Putten et al, "Anisotropic Deposition of Electroless Nickel", J. Electrochem. Soc., vol. 140, No. 8, Aug. 1993, pp. 2229-2235.
A. Van der Putten et al, "Geometrical Effects in the Electroless Metallization of Fine Metal Patterns", J. Electrochem. Soc., vol. 140, No. 8, Aug. 1993, pp. 2221-2228.

Affiliated with

Also associated with

Rating

Method for formation of conductor using electroless plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for formation of conductor using electroless plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for formation of conductor using electroless plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2324073