Method for fabricating capacitor of a semiconductor device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 47, 437919, 148DIG14, H01L 2170

Patent

active

055959318

ABSTRACT:
A method for fabricating a capacitor useful for ultra large scale integration semiconductor devices of 64M DRAM or larger, comprising the steps of: laminating a plurality of insulating layers which are different in etch selection ratio from one another; selectively etching the insulating layers to make a cavity between the insulating layers; depositing a polysilicon layer for a storage electrode over the resulting structure, to fill the cavity; and subjecting the polysilicon layer to etch back to form a spacer.

REFERENCES:
patent: 5053351 (1991-10-01), Fazan et al.
patent: 5071781 (1991-12-01), Seo et al.
patent: 5135883 (1992-08-01), Bae et al.
patent: 5137842 (1992-08-01), Chan et al.
patent: 5164337 (1992-11-01), Ogawa et al.
patent: 5432116 (1995-07-01), Keum et al.
patent: 5436186 (1995-07-01), Hsue et al.
patent: 5449635 (1995-09-01), Jun

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating capacitor of a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating capacitor of a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating capacitor of a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2323908

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.