Hinged circuit assembly with multi-conductor framework

Details Hinged circuit assembly with multi-conductor framework Hinged circuit assembly with multi-conductor framework

1996-10-31

1998-10-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29883, 29884, 2642711, 26427111, 26427112, H01R 4300

Patent

active

058228497

ABSTRACT:
A circuit assembly is made by overmolding, with an electrically insulating material, a unitary framework of electrically conductive material forming coplanar conductors which are connected to each other by an integral structural member. The overmolded material secures the conductors relative to each other and enables portions of the structural member to be severed, electrically isolating the conductors from each other. The overmolded material also positions electrical components having leads that are electrically connected to the conductors. Ends of the conductors are formed into terminals which extend out of a hinge formed in the overmolded material. The hinge enables the terminals to be oriented in a different plane than the conductors.

REFERENCES:
patent: 4631805 (1986-12-01), Olsen et al.
patent: 4637130 (1987-01-01), Fujii et al.
patent: 4649637 (1987-03-01), Hatakeyama
patent: 4821413 (1989-04-01), Schmitt et al.
patent: 4981776 (1991-01-01), Yoshimura
patent: 5201883 (1993-04-01), Atoh et al.

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