Heat exchanging member

Heat exchange – Conduit within – or conforming to – panel or wall structure – Opposed plates or shells

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165185, 165907, F28F 312

Patent

active

052053539

ABSTRACT:
A heat exchanging member, more particularly for cooling a semiconductor module, having at a first and a second side, respectively, inlets and outlets, respectively, for a preferably gaseous heat exchanging medium, and having a heat exchanging component made of a highly thermal conductive material, such as metal, in which channels disposed side by side and running from its inlet side to its outlet side have been formed, such that medium flowing in through the inlet channels is constrained to flow at an angle to the direction of entry via the heat exchanging material to the adjacent outlet channels, characterized in that the heat exchanging material has a structure which comprises packed parts including:

REFERENCES:
patent: 3302704 (1967-02-01), Valvi
patent: 4446851 (1984-05-01), Grose
patent: 4531145 (1985-07-01), Wiech, Jr.
patent: 4777560 (1988-10-01), Herrell et al.
patent: 4843693 (1989-07-01), Chisholm
patent: 4884631 (1989-12-01), Rippel
patent: 4896719 (1990-01-01), O'Neill et al.
patent: 4898234 (1990-02-01), McGovern et al.
patent: 5005640 (1991-04-01), Lapinski et al.
Electronic Packaging & Production, Oct. 30, 1990, No. 10, p. 47.

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