Method of manufacturing a semiconductor device with selective co

Details Method of manufacturing a semiconductor device with selective co Method of manufacturing a semiconductor device with selective co

1992-07-27

1993-04-27

Gorski, Joseph M.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 437217, H01R 4320, H01L 2160

Patent

active

052050360

ABSTRACT:
A method for manufacturing a lead frame for assemble with a semiconductor device comprises the steps of covering, with a cover film, a die to which an electronic device is attached and a conducting section of a lead section to be electrically connected to the die, covering the whole of the die and lead section and the cover film with an inorganic protective film, and removing the cover film and the protective film formed over the cover film to partly expose the die and the conducting section for electric connection.

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