Universal multilayer base board assembly for integrated circuits

Details Universal multilayer base board assembly for integrated circuits Universal multilayer base board assembly for integrated circuits

1994-05-23

1996-01-02

Pirlot, David L.

Electrical connectors

With selectable circuit, e.g., plug board

439 85, 439 65, H01R 2900

Patent

active

054803098

ABSTRACT:
A universal laminated base board assembly for connecting an integrated circuit device to a pcb has a series of alternating, overlying, conductive and insulating layers with two of the conductive layers providing ground and current lines on respective opposite faces. A plurality of through-holes extend through the layers and insulated from the conductive layers for receiving respective socket forming body portions of contact elements selected from signal, current and grounding types with the signal contact elements remaining insulated from the conductive layers and the current and grounding types having conductive layer connecting portions bridging the insulation into connection with the current and ground layers respectively. The contact elements are inserted in those through holes which are aligned with signal, current and ground line terminal lead pins, respectively, of the particular device chosen, adapting the base board to any one of a variety of different devices. The conductive layer connecting portions may be integral with, or formed separately from, respective body portions.

REFERENCES:
patent: 3571923 (1971-03-01), Shaheen
patent: 4095866 (1978-06-01), Merrill
patent: 4201432 (1980-05-01), Chalmers
patent: 4526429 (1985-07-01), Kirkman
patent: 4894016 (1990-01-01), Wright
patent: 4906198 (1990-03-01), Cosimano et al.
patent: 5102352 (1992-04-01), Arisaka
patent: 5213521 (1993-05-01), Arisaka

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