Semiconductor device provided with a package for a semiconductor

Details Semiconductor device provided with a package for a semiconductor Semiconductor device provided with a package for a semiconductor

Filed on

1983-07-08

Date issued

1986-08-26

Examiner

Sikes, William L.

Patent Class

Electricity: conductors and insulators

SubClass

Feedthrough or bushing

SubSubClass

Compression

Other Related Categories

357 74, 174 52FP, H01L 3902, H05K 500

Type

Patent

Status

active

Patent number

046085920

Description

ABSTRACT:
The present invention relates to a semiconductor device including a package for carrying a semiconductor element or chip having a plurality of components, such as transistors, diodes, etc. to which substantially the same voltage is to be applied. The voltage may be supplied to a plurality of electrodes distributed on the semicnductor element. Excessive voltage drop between the components and external leads of the device is inhibited by providing a package with at least one low resistance conductive layer about the periphery of the device which is electrically connected to an external lead of the device and to a plurality of electrodes on the semiconductor element.

REFERENCES:
patent: 3872583 (1975-03-01), Beall et al.
patent: 3908185 (1975-09-01), Martin
patent: 4067040 (1978-01-01), Tsuzuki et al.

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