Low profile mechanical interconnect system having metalized loop

Details Low profile mechanical interconnect system having metalized loop Low profile mechanical interconnect system having metalized loop

1993-06-01

1995-10-10

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361818, 361736, 361752, 174 35R, 174 35MS, 174250, 174256, 174260, 174261, H05K 900, H05K 114

Patent

active

054576105

ABSTRACT:
A substrate (100) includes a surface (102) having a hook and loop fastener area (106). The area (106) is selectively metallized to produce interconnect points (108). The area (106) is used to attach a connector, another substrate, or a flex circuit to the substrate (100) without the use of solder or other conductive adhesives. The area (106) provides for the mechanical coupling. The selectively metallized areas (108) provide for the electrical coupling of the two substrates.

REFERENCES:
patent: 4429348 (1984-01-01), Dean
patent: 4432838 (1984-02-01), Kadija
patent: 4760859 (1988-08-01), Brown
patent: 5012114 (1991-04-01), Sisson, Jr.
patent: 5111354 (1992-05-01), Marzi et al.
patent: 5136119 (1992-08-01), Leyland
patent: 5136470 (1992-08-01), Sheridon et al.

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