Method and apparatus for mounting electronic components

Details Method and apparatus for mounting electronic components Method and apparatus for mounting electronic components

1987-11-30

1989-05-16

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

29740, 29759, H05K 330

Patent

active

048296651

ABSTRACT:
In mounting electronic components (1) from an electronic components pack (5) to a substrate (10), the substrate (10) is put on a table movable horizontally in X-Y directions, and the electronic components (1) are held in through holding holes (3) in a holding plate (2). A selected one of the electronic components (1) is positioned just above a mounting position on the substrate (10) and a pushing pin (23 or 24 or 26) is positioned just above that electronic component (1). Then, the pushing pin (23 or 24 or 26) lowers and pushes the selected electronic component (1) down out of its holding hole (3) to mount it directly onto the substrate (10).

REFERENCES:
patent: 3710479 (1973-01-01), Bernardo et al.
patent: 3963456 (1976-06-01), Tsuchiya et al.
patent: 4451324 (1984-05-01), Ichikawa et al.
patent: 4474639 (1984-10-01), Fritz

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