Diced semiconductor device handler

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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118620, B07C 5344

Patent

active

055107230

ABSTRACT:
An apparatus for testing an unencapsulated, diced semiconductor device comprises a test head. The test head comprises a carousel table having a chamfered portion and a chamfered pedestal. While testing is pending the pedestal rests against the chamfered portion of the carousel table, and the pedestal receives a semiconductor device to be tested. The carousel table rotates 90.degree. to position the semiconductor device under the test head. The pedestal is lifted, and the chamfered nature of the pedestal and the carousel table allow for adjustments to the pedestal in the X-, Y-, and theta-directions to align the die with a probe responsive to signals from a camera positioned above the probe. Once the die is aligned, the pedestal continues to rise until contact is made between bond pads on the die and the probe, and testing is performed.

REFERENCES:
patent: 3863764 (1975-02-01), Myslinski et al.
patent: 4775281 (1988-10-01), Prentakis

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