Semiconductor device and method of fabricating same

Details Semiconductor device and method of fabricating same Semiconductor device and method of fabricating same

1995-06-02

1996-04-23

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257786, H01L 2348

Patent

active

055106544

ABSTRACT:
A semiconductor device having any arbitrary size. The number of input/output terminals can be easily and selectively increased while using input/output amplifier circuit functional portions having the same circuit configuration, by using both ball bonding and TAB bonding techniques. Every two (4A, 4B) of the electrodes on the semiconductor device correspond to each one set of input/output amplifier circuits formed by three ones (6A, 6B, 6C) of the input/output amplifier circuits. The spacing S.sub.1 between the two electrodes (4A, 4B) corresponding to one set of input/output amplifier circuits is substantially equal to the spacing S.sub.2 between the electrode 4B and the adjacent electrode 4C of one adjacent set of input/output amplifier circuits and also to the spacing S.sub.3 between the electrode 4A and the adjacent electrode 4D of the other adjacent set of input/output amplifier circuits.

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