Semiconductor device having a reducing/oxidizing conductive mate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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257295, 257762, 257769, H01G 410

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active

055106510

ABSTRACT:
The present invention includes a semiconductor device having a layer including an elemental metal and its conductive metal oxide, wherein the layer is capable being oxidized or reduced preferentially to an adjacent region of the device. The present invention also includes processes for forming the devices. Substrate regions, silicon-containing layers, dielectric layers, electrodes, barrier layers, contact and via plugs, interconnects, and ferroelectric capacitors may be protected by and/or formed with the layer. Examples of elemental metals and their conductive metal oxides that may be used with the present invention are: ruthenium and ruthenium dioxide, rhenium and rhenium dioxide, iridium and iridium dioxide, osmium and osmium tetraoxide, or the like.

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IBM Technical Disclosure Bulletin; "Diffusion Barrier Between Copper and Silicon;" vol. 35, No. 1B, pp. 214-215 (1992).
Bernstein, et al.; "Fatigue of ferroelectric PbZrxTiyO3 capacitors with Ru and RuOx electrodes"; J. Mater. Res.; vol. 8, No. 1, pp. 12-13 (Jan. 1993).
Brassington; "Memory Applications Of Ferroelectric Thin Films"; IEDMS, pp. 1-8 (1990).
Wolf, et al.; "Silicon Processing for the VLSI Era"; vol. 1; pp. 171-175 (1986).
Dickerson, et al.; "Chemical Principals"; Second Edition; pp. 662-670 (1974).

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