Method of forming multilayer interconnection structure

Details Method of forming multilayer interconnection structure Method of forming multilayer interconnection structure

1992-06-23

1993-07-13

Lusigan, Michael

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 99, 4272551, 427282, C23C 1600

Patent

active

052271919

ABSTRACT:
The disclosure relates to a method of forming a multilayer interconnection structure. The structure is a laminated body having a first conductive layer, a first insulating layer, a second conductive layer and a second insulating layer in an ascending order. In the method, firstly, a through-hole is formed on the laminated body so as to expose a surface of the first conductive layer and two opposed surfaces of the second conductive layer. Then, the two opposed surfaces of the second conductive layer is masked with a masking film, so as not to deposit thereon a metal which has a strong and selective adhesion on the first and second conductive layers. Then, the metal is deposited on the surface of the first conductive layer by a chemical vapor deposition method so as to fill a lower portion of the through-hole with the metal. Then, the masking film is removed so as to expose the two opposed surfaces of the second conductive layer. Then, the metal is deposited on the two opposed surfaces of the second conductive layer by the chemical vapor deposition method so as to fill an upper portion of the through-hole with the metal, such that the through-hole is filled with the metal and that the first and second conductive layers are interconnected with each other. Even if a through-hole has a high aspect ratio, the through-hole is filled with a metal, without having a void space therein.

REFERENCES:
patent: 3691632 (1972-09-01), Smith
patent: 4650696 (1987-03-01), Raby

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