Flip chip screen printing method

Details Flip chip screen printing method Flip chip screen printing method

1997-08-19

2000-01-25

Yan, Ren

Printing

Stenciling

Processes

101123, B41M 112

Patent

active

060167467

ABSTRACT:
Printing systems and processes are described. In a preferred implementation, a print system includes a platen, a print device and a print substance vibrator. A substrate upon which printing is desired is placed on the platen and the print device is placed operably adjacent thereto. A print substance is applied over the print device and through at least one perforation in the print device and onto the substrate. In one aspect, the print device comprises a screen and the print system is configured for screen printing. In another more preferred aspect, the print device comprises a stencil and the print system is configured for stencil printing. The print device and substrate are then separated from one another while a vibrative force is imparted to the print substance by the print substance vibrator. In a preferred implementation, the print substance vibrator comprises a transducer which is configured to impart vibrative force having a frequency greater than about 2000 Hz, and even more preferably in the ultrasonic range. The preferred transducer can be connected with or to one or more of the print device, the platen, and/or the substrate.

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patent: 4606966 (1986-08-01), Kohn
patent: 4909145 (1990-03-01), Ericsson
patent: 5298687 (1994-03-01), Rapoport et al.
patent: 5395040 (1995-03-01), Holzmann
patent: 5407488 (1995-04-01), Ray
patent: 5483884 (1996-01-01), Vellanki
patent: 5537920 (1996-07-01), Hasegawa et al.

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