Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1975-11-21
1977-08-23
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29578, 357 91, B01J 1700
Patent
active
040430243
ABSTRACT:
A method of manufacturing a semiconductor storage device comprises the steps of forming a source region and a drain region in a surface of a semiconductor substrate of a first conductivity type in a manner to be spaced from each other, said source and drain regions having a second conductivity type; forming an insulating film on said semiconductor substrate between said source and drain regions; implanting ions of an electrically conductive element into said insulating film, to thus form a floating gate; and leading out source and drain electrodes from said source and drain regions, respectively. By varying the implantation energy and the implantation dose rate in the implanting step, the amount of charges to be accumulated in the floating gate can be controlled.
REFERENCES:
patent: 3328210 (1967-06-01), McCaldin
patent: 3413531 (1968-11-01), Leith
patent: 3507709 (1970-04-01), Bower
patent: 3852120 (1974-12-01), Johnson
patent: 3873373 (1975-03-01), Hill
Hitachi , Ltd.
Tupman W.
LandOfFree
Method of manufacturing a semiconductor storage device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a semiconductor storage device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor storage device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2306595