Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-08-09
1993-07-13
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
156656, 1566591, 174261, 205125, 205126, H05K 302
Patent
active
052262324
ABSTRACT:
A method for processing an integrated circuit of the type having conductive die bond pads thereon. The fabricated IC is coated with a layer of photoresist. The photoresist is exposed to create a pattern which includes windows over the pads and a connection between at least two of the pads. The exposed photoresist is dissolved and the exposed portions are plated with gold to a depth sufficient for creating a bump over each die bond pad suitable for bonding a conductive lead thereto. The remaining photoresist is dissolved thus leaving a plurality of bumps for attaching conductive leads thereto and an electrical connection between at least two of the bumps.
REFERENCES:
patent: 3169892 (1965-02-01), Lemelson
patent: 3957552 (1976-05-01), Ahn et al.
patent: 4394678 (1983-07-01), Winchell, II et al.
patent: 4436766 (1984-03-01), Williams
patent: 4601915 (1986-07-01), Allen et al.
patent: 4652336 (1987-03-01), Andrascek et al.
patent: 4861425 (1989-08-01), Greer et al.
patent: 4927505 (1990-05-01), Sharma et al.
patent: 5118386 (1992-06-01), Kataoka et al.
Arbes Carl J.
Hewlett--Packard Company
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