Method for packaging a semiconductor device having projected ele

Details Method for packaging a semiconductor device having projected ele Method for packaging a semiconductor device having projected ele

1993-06-17

1995-10-10

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29833, 22818021, H05K 330, H05K 334

Patent

active

054560039

ABSTRACT:
A method for packaging a semiconductor device having projected electrodes is provided. The method includes the steps of: (a) placing the semiconductor device on a substrate having a plurality of groups of metallic projections formed thereon; (b) bonding electrodes of the semiconductor device with one of the groups of metallic projections at least by pressure so that the bonding strength of the metallic projections with the electrodes is greater than that of the metallic projections with the substrate; (c) repeating steps (a) and (b) until a prescribed number of semiconductor devices are bonded to the substrate through the groups of metallic projections, and transporting the substrate having the plurality of semiconductor devices; (d) transferring each of the groups of metallic projections to the semiconductor device bonded therewith by removing the semiconductor device from the substrate with the group of metallic projections attached to the electrodes of the semiconductor device; (e) placing the semiconductor device with the group of metallic projections attached thereto on a wiring board; and (f) bonding the semiconductor device with the group of metallic projections attached thereto with the wiring board.

REFERENCES:
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 3859723 (1975-01-01), Hamer et al.
patent: 4494688 (1985-01-01), Hatada et al.
patent: 4693770 (1987-09-01), Hatada

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