Leadless pad array chip carrier

Details Leadless pad array chip carrier Leadless pad array chip carrier

1992-11-16

1993-08-31

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257787, 257693, 257774, 257786, 174 522, 361728, 361736, 361768, 361777, H01L 2302, H01L 2328, H05K 700

Patent

active

052411338

ABSTRACT:
A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

REFERENCES:
patent: 4460537 (1984-07-01), Heinle
patent: 4688152 (1987-08-01), Chia
patent: 4822550 (1989-04-01), Komathu
patent: 4935581 (1990-06-01), Komathu
patent: 4961105 (1990-10-01), Yamamoto
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5107329 (1992-04-01), Okinaga et al.

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