Semiconductor device having soldered bond between base and cap t

Details Semiconductor device having soldered bond between base and cap t Semiconductor device having soldered bond between base and cap t

1984-11-28

1986-12-02

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361395, 357 80, 174 52FP, H05K 720

Patent

active

046269606

ABSTRACT:
A semiconductor device including a ceramic base having a cavity carrying a semiconductor chip, and a ceramic cap covering and sealing the ceramic base. The cap has a metallization pattern covering not only a region where it contacts the base but also the four side surfaces of the cap, which is provided in order to prevent flow or flying out of excess solder toward the outside of the cap and the base and into the cavity.

REFERENCES:
patent: 3943557 (1976-03-01), Frazee
IBM Tech Discl. Bull. vol. 19, No. 8, Jan. 1977, Pittwood, "Low-Temp-Modules", p. 2961.
IBM Tech Discl. Bull. vol. 20, No. 8, Jan. 1978, Francis, "Forming a Hermetic-Package", p. 3085.

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