Method of improving the mechanical properties of semiconductor m

Details Method of improving the mechanical properties of semiconductor m Method of improving the mechanical properties of semiconductor m

1991-08-22

1993-08-31

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

264 12, B29D 1100

Patent

active

052406709

ABSTRACT:
Mechanically toughened GaAs and other group III-V and group II-VI materials by hot-forging the GaAs and other materials to obtain the toughening or increase in mechanical strength. The material to be toughened is heated to its plastic temperature or higher but sufficiently below its melting point to maintain decomposition of the material to an acceptable level. A force or stress is then applied along a surface of the material which, acting in concert with the thermal energy (temperature) on the GaAs, is sufficient to nucleate and move dislocations along slip planes in the material to obtain slip or plastic deformation. The material is thereby being flattened due to the stress applied thereto, resulting in a fine, almost polycrystalline or textured (micron size grains) material. This slip process forms many dislocations throughout the GaAs and slightly rearranges most of the parts of the crystal. Therefore, if a crack must move through the material, there remains no one cleavage plane that extends from one end of the crystal to the other whereat the crack can continue to propagate. The crystallographic plane has been interrupted by all of the dislocations therein. It is this texturing of the material that increases the energy required to propagate a crack in the material and which renders the material tougher or mechanically stronger.

REFERENCES:
patent: 3794704 (1974-02-01), Strong
patent: 4118448 (1978-10-01), Anderson
patent: 4171400 (1979-10-01), Rosette et al.
patent: 4347210 (1982-08-01), Maguire et al.
patent: 4410468 (1983-10-01), Packer

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