Electroless plating

Details Electroless plating Electroless plating

Filed on

1974-11-08

Date issued

1976-11-23

Examiner

Hayes, Lorenzo B.

Patent Class

Compositions: coating or plastic

SubClass

Coating or plastic compositions

SubSubClass

Metal-depositing composition or substrate-sensitizing...

Other Related Categories

204 30, 427304, C23C 302

Type

Patent

Status

active

Patent number

039934918

Description

ABSTRACT:
Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.

REFERENCES:
patent: 2472393 (1949-06-01), Avallone et al.
patent: 2519672 (1950-08-01), Lawless
patent: 3011920 (1961-12-01), Shipley
patent: 3671291 (1972-06-01), Miller et al.
patent: 3682671 (1972-08-01), Zeblisky
patent: 3736157 (1973-05-01), Hacias

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