Epoxy resin compositions and semiconductor devices encapsulated

Details Epoxy resin compositions and semiconductor devices encapsulated Epoxy resin compositions and semiconductor devices encapsulated

1991-06-12

1992-11-10

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

528 97, 525481, 525482, C08L 6302, C08L 6304, C08K 336

Patent

active

051624001

ABSTRACT:
An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.

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