Electroless copper plating bath

Details Electroless copper plating bath Electroless copper plating bath

1974-02-26

1977-07-19

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C23C 302

Patent

active

040366510

ABSTRACT:
An electroless copper plating bath comprising a copper salt, a chelating agent, an alkali pH adjusting agent, formaldehyde, and sodium hypophosphite as a plating rate accelerator.

REFERENCES:
patent: 3093509 (1963-06-01), Wein
patent: 3095309 (1963-06-01), Zeblisky et al.
patent: 3318711 (1967-05-01), Foulke
patent: 3403035 (1968-09-01), Schneble et al.
patent: 3615732 (1971-10-01), Shipley et al.
patent: 3726707 (1973-04-01), Prosser et al.

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