Flexible printed circuit board and coverlay film and manufacture

Details Flexible printed circuit board and coverlay film and manufacture Flexible printed circuit board and coverlay film and manufacture

1991-07-15

1992-11-10

Cannon, James C.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Halogen containing compound

156315, 174259, 428209, 428336, 428414, 428416, 4284735, 428901, B32B 1508, B32B 2708, B32B 2718, B32B 2738, C09J 702

Patent

active

051621401

ABSTRACT:
Disclosed herein is a flexible printed circuit board and coverlay film and a method for producing the same. The board and coverlay film have metal foil or parting paper adhered to a polyimide film using a two-layer thermosetting adhesive. The first layer of adhesive on the polyimide film is about 5 .mu.m thick or less. The circuit board and coverlay film produced according to this invention have excellent bonding strength, thermal, chemical and weather resistance, as well as good insulating properties.

REFERENCES:
patent: 5084124 (1992-01-01), Taniguchi

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