Semiconductor device having a plastic package

Details Semiconductor device having a plastic package Semiconductor device having a plastic package

1997-05-27

1998-03-24

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257707, 257712, 257796, 257675, H01L 2336, H01L 2340

Patent

active

057316325

ABSTRACT:
A resin-sealed type semiconductor device has a bed holding a semiconductor element on one surface and is provided with a plurality of protrusions on another surface. A lead frame includes a plurality of outer leads formed integral with the corresponding one of a plurality of inner leads, a bed section, and hanging pins for supporting the bed section. Each of the plurality of inner leads is connected to the corresponding one of a plurality of electrode pads by one of bonding wires. The semiconductor element, bonding wires, inner leads, hanging pins, and bed are sealed with resin such that the one surface of the bed, on which the protrusions are formed, is exposed to the outside.

REFERENCES:
patent: 5041902 (1991-08-01), McShane
patent: 5105259 (1992-04-01), McShane et al.
patent: 5430331 (1995-07-01), Hamzehdoost et al.
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5442234 (1995-08-01), Liang
patent: 5444025 (1995-08-01), Sono et al.

Affiliated with

Also associated with

Rating

Semiconductor device having a plastic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a plastic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a plastic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2291194