Method of self-packaging an IC chip

Details Method of self-packaging an IC chip Method of self-packaging an IC chip

1989-02-17

1990-04-10

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29841, 361386, 361389, H05K 320

Patent

active

049148125

ABSTRACT:
A method of self packaging an integrated circuit chip on a printed circuit board where conductive leads form an electrical connection with interconnect leads on the printed circuit board. A centering frame placed on the printed circuit board serves to align the leads. A cooling cap which dissipates heat from the integrated circuit chip is placed over the centering frame and integrated circuit chip. In one embodiment, the leads form a pressure fit and the cooling cap forces the pressure-fit electrical connections. In another embodiment, the leads make rubbing contact with each other.

REFERENCES:
patent: 3597839 (1971-08-01), Jaccodine
patent: 3610870 (1971-10-01), Sakamoto
patent: 4404745 (1983-09-01), Resneau
patent: 4437235 (1984-03-01), McIver
patent: 4658331 (1987-04-01), Berg
patent: 4679118 (1987-07-01), Johnson
patent: 4731693 (1988-03-01), Berg
patent: 4745456 (1988-05-01), Clemens
patent: 4758927 (1988-07-01), Berg
patent: 4775916 (1988-10-01), Kouzuchi
patent: 4812949 (1989-03-01), Fontan

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