Fine flip chip interconnection

Details Fine flip chip interconnection Fine flip chip interconnection

1998-05-28

1999-07-13

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438118, 438612, 438613, H01L 2144

Patent

active

059239557

ABSTRACT:
There is disclosed a process for creating a flip chip bonded combination for a first integrated circuit and a second integrated circuit. Creating a first connection means on each bonding pad of a first integrated circuit within a first wall structure and a second connection means on each bonding pad of a second integrated circuit within a second wall structure. Removing the second wall structure and partially placing each second connection means within the first wall structure over a respective connection means of the first integrated circuit.

REFERENCES:
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5547530 (1996-08-01), Nakamura et al.
patent: 5786238 (1998-07-01), Pai et al.

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