Measuring and testing – Fluid pressure gauge – Diaphragm
Patent
1984-12-06
1986-12-02
Woodiel, Donald O.
Measuring and testing
Fluid pressure gauge
Diaphragm
29 2541, 29454, 148 15, 361283, G01L 912, H01G 516
Patent
active
046255613
ABSTRACT:
A capacitive pressure sensor uses two silicon wafers hermetically sealed to each other by recrystallized silicon formed by the migration of a ring of silicon-aluminum eutectic material from the wafer interface to the surface of one wafer. Within the ring of the eutectic a cavity with opposing conductive plates forms a capacitor. Another high conductivity path through the wafer can be formed simultaneously with the ring of eutectic material by placing an aluminum dot on the interior side of one silicon wafer. Thus, a high conductivity path is available through a silicon wafer for each of the two capacitor plates.
REFERENCES:
patent: 3956024 (1976-05-01), Cline et al.
patent: 4177496 (1979-12-01), Bell et al.
patent: 4184189 (1980-01-01), Davis et al.
patent: 4190467 (1980-02-01), Lien
patent: 4207604 (1980-06-01), Bell
patent: 4261086 (1981-04-01), Giachino et al.
patent: 4345299 (1982-08-01), Ho
patent: 4386453 (1983-06-01), Giachino et al.
patent: 4390925 (1983-06-01), Freud
patent: 4415948 (1983-11-01), Grantham et al.
patent: 4420790 (1983-12-01), Golke et al.
patent: 4424713 (1984-01-01), Kroninger, Jr. et al.
patent: 4467394 (1984-08-01), Grantham et al.
patent: 4495820 (1985-01-01), Shimada et al.
Abolins Peter
Ford Motor Company
Sanborn Robert D.
Woodiel Donald O.
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