Method of processing a circuit board

Details Method of processing a circuit board Method of processing a circuit board

1991-10-24

1992-11-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

65 61, 83 53, 83177, 156667, 264 61, 428698, 501 96, H05K 302

Patent

active

051613050

ABSTRACT:
In a method of processing a circuit board formed of an aluminum nitride sintered body, a substrate (100) formed of an aluminum nitride sintered body is prepared. A groove (101) and a hole (102) are formed in the substrate (100) formed of the aluminum nitride sintered body by directing a water jet to a surface of the substrate (100). Alternatively, interconnection layers (104) and an electric resistant body (103) connecting the interconnection layers (104) are formed on the surface of the substrate (100), and a notch portion (105) is formed in the electric resistant body (103) by directing the water jet to the surface of the electric resistant body (103). In this manner, processing of the substrate (100) and adjustment of an electrical resistance value of the electric resistant body (103) can be carried out precisely.

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Kino Zairyo, p. 60, Oct. 1987 by N. Iwase enclosed are pp. 57-66.

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