High heat dissipation mounting for solid state devices and circu

Details High heat dissipation mounting for solid state devices and circu High heat dissipation mounting for solid state devices and circu

1975-08-13

1978-01-17

Wojciechowicz, Edward J.

357 72, 357 79, 357 81, H01L 2328, H01L 2342, H01L 3902, H01L 2302

Patent

active

040694976

ABSTRACT:
A solid state device or circuit mounted or printed on a heat conductive ceramic substrate such as beryllia is brought into thermal conductive relation with a metal heat dissipation plate as by clamping with no intervening materials such as an adhesive or solder therebetween.

REFERENCES:
patent: 3513362 (1970-05-01), Yamamoto
patent: 3764507 (1973-10-01), McKinnon et al.
patent: 3801874 (1974-04-01), Stefani
patent: 3801882 (1974-04-01), Ward
patent: 3902148 (1975-08-01), Drees et al.

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