Metal treatment – Compositions – Heat treating
Patent
1976-03-16
1978-01-17
Ozaki, G.
Metal treatment
Compositions
Heat treating
148187, 148188, H01L 2126
Patent
active
040690679
ABSTRACT:
A semiconductor device is described comprising a semiconductor substrate, plural impurity-diffused regions formed in the substrate, an insulation layer formed so as to cover selected parts of the substrate, plural low-resistance semiconductor regions isolated from each other by the insulation layer and at least some of them contacting said diffused regions and conductive regions disposed in a manner to contact said low-resistance semiconductor regions, respectively.
Thus, the low-resistance semiconductor regions serve as connection means between the diffused region and the conductive region, which means serves to uniform contacting level, thereby decreasing the size of the device.
REFERENCES:
patent: 3664896 (1972-05-01), Duncan
patent: 3673679 (1972-07-01), Carbajal et al.
patent: 3730778 (1973-05-01), Shannon et al.
patent: 3771218 (1973-11-01), Langdon
patent: 3793088 (1974-02-01), Eckton, Jr.
Matsushita Electric - Industrial Co., Ltd.
Ozaki G.
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