1979-02-14
1980-12-02
Corbin, John K.
350 91, 350235, 350238, G02B 2106
Patent
active
042367816
ABSTRACT:
A bonding apparatus for IC pellets is provided with an illumination system for illuminating the IC pellet and a microscope for observing the IC pellet. The illumination system is of reflected dark field illumination since the circuit pattern and pad for IC pellet bonding is coarse in the surface while the remaining IC pellet region has a mirror face. The illumination system includes a light source providing a spot light and a light reflecting plate for converting the spot light into scattered light. The light source and the light reflecting plate are both so disposed that the spot light from the light source is not directed directly to the pellet but directed to the light diffusion plate. The light diffusion plate is disposed so that the scattered light reflected by the light diffusion plate is directed to the pellet. The microscope is disposed so as to receive a specified light irregularly reflected by the pattern with coarse face in the light incident to the IC pellets.
REFERENCES:
patent: 3710091 (1973-01-01), Holcomb
patent: 3941486 (1976-03-01), Tyler
Circon Corp., "Circon MV 9100", Feb. 1, 1973.
Corbin John K.
Koren Matthew W.
Tokyo Shibaura Electric Co. Ltd.
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